| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 01 | WO/2024/244426 | DISPLAY PANEL AND DISPLAY DEVICE | CN2023/140827 | H01L 27/15 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2025/059968 | FLAT PANEL DETECTOR AND DETECTION DEVICE | CN2023/120297 | H01L 27/146 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2025/129771 | WIRING SUBSTRATE AND PREPARATION METHOD THEREFOR, LIGHT-EMITTING SUBSTRATE, AND DISPLAY APPARATUS | CN2024/071693 | H01L 23/498 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2025/179548 | ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE | CN2024/079397 | H01L 27/12 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2025/194507 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | CN2024/083390 | H01L 27/15 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2025/250904 | TREATMENTS FOR IMPROVING FRACTURE STRENGTH FOR SEMICONDUCTOR WORKPIECE | US2025/031597 | H01L 21/02 | WOLFSPEED, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000178 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | CN2024/101338 | H01L 25/16 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000190 | LIGHT-EMITTING UNIT AND MANUFACTURING METHOD THEREFOR, AND LIGHT-EMITTING DIODE CHIP | CN2024/101399 | H01L 25/075 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000291 | TERMINATION STRUCTURE OF A SUPER-JUNCTION METAL-OXIDE SEMICONDUCTOR | CN2024/101931 | H01L 29/06 | NEXPERIA B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000718 | LED DISPLAY DEVICE AND MANUFACTURING METHOD FOR LED DISPLAY DEVICE | CN2024/125478 | H01L 25/075 | FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000727 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CN2024/126303 | H01L 23/64 | CXMT CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000756 | GOLD-SILVER ALLOY STRUCTURE FOR SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFOR | CN2024/129800 | H01L 23/488 | SHENZHEN UNITED BLUE OCEAN APPLIED MATERIALS TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/000904 | SYSTEM-IN-PACKAGE MODULE AND PREPARATION METHOD, AND SMART RING | CN2024/142255 | H01L 23/31 | QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO.,LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001000 | QFN PACKAGED CHIP | CN2025/076764 | H01L 23/495 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001004 | CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | CN2025/076827 | H01L 25/18 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001040 | CHIP PACKAGING ASSEMBLY, PREPARATION METHOD AND ELECTRONIC DEVICE | CN2025/079274 | H01L 25/07 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001061 | SEMICONDUCTOR MODULE | CN2025/080096 | H01L 25/07 | HISENSE HOME APPLIANCES GROUP CO.,LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001107 | FEEDING DEVICE AND FEEDING METHOD FOR CONVEYING LEAD FRAMES | CN2025/083141 | H01L 21/677 | SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001108 | CONVEYING DEVICE FOR LEAD FRAME | CN2025/083149 | H01L 21/677 | SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001111 | BGA CHIP PACKAGING STRUCTURE AND TESTING METHOD | CN2025/083224 | H01L 23/49 | SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001148 | SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR INTEGRATED STRUCTURE | CN2025/085550 | H01L 23/498 | CXMT CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001150 | HEAT DISSIPATION PACKAGE STRUCTURE AND ELECTRONIC DEVICE | CN2025/085832 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001263 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION DEVICE | CN2025/091263 | H01L 23/473 | ZTE CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001294 | CHIP PACKAGE STRUCTURE AND RADIO FREQUENCY FRONT-END MODULE | CN2025/092160 | H01L 23/31 | RADROCK (CHONGQING) MICROELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001338 | ARRAY SUBSTRATE, MANUFACTURING METHOD AND DISPLAY DEVICE | CN2025/093841 | H01L 21/77 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001349 | HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS | CN2025/093941 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001351 | SUBSTRATE AND MANUFACTURING METHOD THEREFOR, INTEGRATED PASSIVE DEVICE, AND ELECTRONIC APPARATUS | CN2025/094136 | H01L 23/498 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001365 | SUBSTRATE EDGE ETCHING APPARATUS | CN2025/094300 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001518 | SUBSTRATE POSITIONING DEVICE AND SUBSTRATE POSITIONING METHOD | CN2025/097638 | H01L 21/68 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001574 | SUSPENDED HOLLOW SHAFT MAGNETIC LEVITATION WAFER MANUFACTURING APPARATUS | CN2025/098614 | H01L 21/687 | SUZHOU SUPERMAG INTELLIGENT TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001752 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | CN2025/101369 | H01L 25/065 | YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001808 | ALUMINUM FILM FOR PAD LAYER OF WAFER, AND COATING PROCESS THEREFOR | CN2025/101955 | H01L 23/488 | HANGZHOU MDK OPTO ELECTRONICS CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001853 | DIE ATTACHING MACHINE | CN2025/102458 | H01L 21/683 | CHIPMORE TECHNOLOGY CORPORATION LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001857 | HALF-BRIDGE POWER MODULE, INVERTER, AND VEHICLE | CN2025/102492 | H01L 23/367 | SHANGHAI LIXIANG AUTOMOBILE CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/001952 | METHOD FOR METALLIZATION OF ULTRA-HIGH ASPECT RATIO THROUGH SILICON VIA IN THREE-DIMENSIONAL INTEGRATED CIRCUIT | CN2025/103015 | H01L 21/768 | XIAMEN UNIVERSITY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/002147 | MICRO LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR | CN2025/103999 | H01L 25/16 | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/002464 | SUBSTRATE STORAGE SYSTEM, SUBSTRATE HANDLING APPARATUS, METHOD OF TEMPORARILY STORING A SUBSTRATE | EP2025/063333 | H01L 21/67 | ASML NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/002645 | CLAMPING SYSTEMS AND METHODS FOR SEMICONDUCTOR PROCESSING | EP2025/066419 | H01L 21/683 | ASML NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/002717 | ADJUSTING DEVICE, USE OF SUCH AN ADJUSTING DEVICE FOR POSITIONING OBJECTS, AND METHOD FOR POSITIONING OBJECTS USING SUCH AN ADJUSTING DEVICE | EP2025/066884 | H01L 21/687 | PHYSIK INSTRUMENTE (PI) SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003423 | ELECTROMAGNETIC ABSORBING ARRANGEMENT | FI2025/050352 | H01L 23/552 | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003547 | SEMICONDUCTOR CAPACITOR AND METHOD FOR MANUFACTURING SAME | IB2024/000292 | H01L 21/822 | NISSAN MOTOR CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003633 | FLUID JET COOLING DEVICE FOR ELECTRONIC EQUIPMENT | IB2025/055881 | H01L 23/473 | WIELAND PROVIDES SRL | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003642 | HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES | IB2025/055972 | H01L 23/31 | INTERNATIONAL BUSINESS MACHINES CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003900 | METHOD FOR OPERATING SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION APPARATUS | JP2024/022776 | H01L 21/3065 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003905 | PLASMA TREATMENT METHOD | JP2024/022802 | H01L 21/3065 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003906 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | JP2024/022805 | H01L 21/306 | NTT, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003907 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2024/022806 | H01L 21/66 | NTT, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003909 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2024/022813 | H01L 29/78 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003911 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | JP2024/022834 | H01L 21/205 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003919 | STRAIN INTRODUCTION METHOD | JP2024/022862 | H01L 21/324 | NTT, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003932 | FILM DEPOSITION APPARATUS AND LASER MACHINING APPARATUS | JP2024/022895 | H01L 21/301 | YAMAHA HATSUDOKI KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003968 | FILM FORMING APPARATUS AND LASER PROCESSING APPARATUS | JP2024/023042 | H01L 21/301 | YAMAHA HATSUDOKI KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003996 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | JP2024/023187 | H01L 21/52 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/003997 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2024/023188 | H01L 21/52 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004012 | POWER ELEMENT MODULE | JP2024/023239 | H01L 23/40 | MITSUBISHI HEAVY INDUSTRIES ENGINE & TURBOCHARGER, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004030 | PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICE | JP2024/023297 | H01L 21/02 | JSW AKTINA SYSTEM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004034 | PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICE | JP2024/023303 | H01L 21/02 | JSW AKTINA SYSTEM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004036 | PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE | JP2024/023313 | H01L 21/3065 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004037 | PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICE | JP2024/023316 | H01L 21/268 | JSW AKTINA SYSTEM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004038 | PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICE | JP2024/023317 | H01L 21/268 | JSW AKTINA SYSTEM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004052 | SUBSTRATE STORAGE CONTAINER, FILTER UNIT, AND AGGREGATED FILTER | JP2024/023364 | H01L 21/673 | MIRAIAL CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004107 | SEMICONDUCTOR THIN FILM STRUCTURE | JP2024/023556 | H01L 21/20 | NTT, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004114 | COOLER AND SEMICONDUCTOR DEVICE | JP2024/023577 | H01L 23/473 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004127 | LIGHT DETECTION DEVICE AND RANGING DEVICE | JP2024/023610 | H01L 31/107 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004139 | SUBSTRATE PROCESSING DEVICE, TEACHING METHOD FOR TRANSFER MACHINE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE TRANSFER SYSTEM, AND PROGRAM | JP2024/023664 | H01L 21/67 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004197 | CLEANING METHOD | JP2025/003371 | H01L 21/677 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004286 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | JP2025/013360 | H01L 21/768 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004294 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | JP2025/013851 | H01L 21/304 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004347 | OPTICAL PACKAGE, MODULE, AND METHOD FOR MANUFACTURING OPTICAL PACKAGE | JP2025/016632 | H01L 23/02 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004352 | SEMICONDUCTOR DEVICE | JP2025/016839 | H01L 25/07 | FUJI ELECTRIC CO.,LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004360 | METHOD AND SYSTEM FOR REUSING REACTIVE GAS | JP2025/017155 | H01L 21/205 | ORGANO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004372 | ELECTRONIC COMPONENT | JP2025/017457 | H01L 25/00 | MURATA MANUFACTURING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004395 | CUTTING DEVICE AND METHOD FOR PRODUCING CUT ARTICLE | JP2025/018041 | H01L 21/301 | TOWA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004465 | VAPOR CHAMBER COMPOSITE MANUFACTURING METHOD AND LAMINATE MANUFACTURING METHOD | JP2025/019432 | H01L 23/427 | NHK SPRING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004548 | GRINDING METHOD FOR SEMICONDUCTOR CRYSTAL AND GRINDING WHEEL FOR GRINDING USED IN SAID GRINDING METHOD | JP2025/020671 | H01L 21/304 | SUCCESS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004573 | SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING DEVICE | JP2025/020875 | H01L 21/02 | CENTRAL GLASS COMPANY, LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004574 | DRY ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ETCHING DEVICE | JP2025/020876 | H01L 21/302 | CENTRAL GLASS COMPANY, LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004597 | PLASMA PROCESSING APPARATUS | JP2025/021062 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004601 | TRANSPORTATION DEVICE AND CONNECTION METHOD | JP2025/021080 | H01L 21/677 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004649 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, PROGRAM, AND STORAGE MEDIUM | JP2025/021467 | H01L 21/304 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004650 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, PROGRAM, AND STORAGE MEDIUM | JP2025/021469 | H01L 21/304 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004670 | PROCESSING SYSTEM, PROCESSING METHOD, AND TRANSPORT DEVICE | JP2025/021605 | H01L 21/50 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004709 | SEMICONDUCTOR DEVICE | JP2025/021909 | H01L 23/31 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004725 | TREATMENT DEVICE AND TREATMENT METHOD | JP2025/021993 | H01L 21/027 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004729 | TREATMENT LIQUID FOR SEMICONDUCTOR SUBSTRATE | JP2025/022046 | H01L 21/306 | TOKUYAMA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004734 | CONVEYANCE-CONTAINER LID FALL-OFF DETECTION DEVICE, LOAD PORT, AND CONVEYANCE-CONTAINER LID FALL-OFF DETECTION METHOD | JP2025/022068 | H01L 21/677 | SINFONIA TECHNOLOGY CO.,LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004740 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | JP2025/022094 | H01L 23/48 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004849 | METHOD FOR MANUFACTURING ε-TYPE GALLIUM OXIDE FILM, AND ε-TYPE GALLIUM OXIDE FILM | JP2025/022698 | H01L 21/203 | TAK THIN FILM DEVICE LABORATORY INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004886 | MOUNTING APPARATUS | JP2025/022804 | H01L 21/60 | SHINKAWA LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/004976 | METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODY | JP2025/023080 | H01L 21/52 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005028 | SUPPORT MEMBER, ELECTROSTATIC CHUCK, HEATER, AND PLASMA TREATMENT DEVICE | JP2025/023273 | H01L 21/683 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005147 | SUBSTRATE PROCESSING SYSTEM | KR2024/017534 | H01L 21/67 | WONIK IPS CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005148 | SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING SYSTEM INSTALLATION METHOD | KR2024/017537 | H01L 21/67 | WONIK IPS CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005149 | BUFFER MODULE AND SUBSTRATE PROCESSING SYSTEM INCLUDING SAME | KR2024/017539 | H01L 21/677 | WONIK IPS CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005175 | POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | KR2025/002666 | H01L 23/495 | LX SEMICON CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005176 | POWER SEMICONDUCTOR MODULE | KR2025/002667 | H01L 23/495 | LX SEMICON CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005220 | HEATING DEVICE AND METHOD FOR HEATING TO-BE-PROCESSED SEMICONDUCTOR SUBSTRATE IN LASER ANNEALING PROCESS, LASER ANNEALING DEVICE AND METHOD USING SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND METHOD | KR2025/004709 | H01L 21/67 | RNR LAB INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005272 | DISPLAY APPARTUS HAVING DISPLAY MODULE | KR2025/006337 | H01L 25/075 | SAMSUNG ELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005346 | CERAMIC SUSCEPTOR INCLUDING CORE/SHELL STRUCTURED MATERIAL AS COATING LAYER | KR2025/008062 | H01L 21/687 | KSM COMPONENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005369 | DISPLAY DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING SAME | KR2025/008347 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005384 | DISPLAY DEVICE AND ELECTRONIC DEVICE | KR2025/008484 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005440 | THIN FILM FORMING METHOD | KR2025/008800 | H01L 21/02 | JUSUNG ENGINEERING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005481 | POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR MODULE | KR2025/008905 | H01L 25/07 | LX SEMICON CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005503 | ANISOTROPIC CONDUCTIVE MATERIAL COMPOSITION | KR2025/008986 | H01L 23/00 | ENJET CO. LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005504 | CONNECTION STRUCTURE | KR2025/008989 | H01L 23/00 | ENJET CO. LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005601 | Method for light-induced release of one or more components from a donor substrate to an acceptor substrate, and a donor substrate and system therefor | NL2025/050311 | H01L 21/67 | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005782 | PLATFORM-INTEGRABLE INTERCONNECTS FOR CONTACTLESS COUPLING OF COMPUTER MODULES | US2024/035932 | H01L 23/66 | INTEL CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005821 | HIGH BANDWIDTH FLASH MEMORY CONTAINING A STACK OF BONDED LOGIC AND MEMORY DIE ASSEMBLIES AND METHODS FOR FORMING THE SAME | US2025/011303 | H01L 23/00 | SANDISK TECHNOLOGIES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005837 | METHOD AND APPARATUS FOR DAMASCENE ETCHING | US2025/019103 | H01L 21/311 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005841 | CONFIGURABLE DIE-TO-DIE LANE REPAIR IN MULTI-DIE SYSTEMS COUPLED USING LINK MACROS | US2025/019266 | H01L 21/66 | MICROSOFT TECHNOLOGY LICENSING, LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005849 | BONDING METHOD WITH LOCATION SPECIFIC PROCESSING | US2025/019479 | H01L 21/18 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005892 | BATTERY CELLS WITH STACKED ELECTRICAL CONDUCTORS | US2025/028299 | H01L 21/768 | KYMA BATTERIES LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005894 | SUBSTRATE PROCESSING FOR IMPROVED WAFER THICKNESS UNIFORMITY | US2025/028546 | H01L 21/3065 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005908 | IN-LINE WAFER POSITIONING SYSTEM USING IR IMAGING | US2025/029723 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005920 | ELECTROMAGNETIC INTERFERENCE SHIELD HAVING MESH GRID GROUND FENCE METALLIZATION PATTERN | US2025/030220 | H01L 23/552 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005921 | WAFER OVERLAY REGISTRATION IN HYBRID BONDING | US2025/030264 | H01L 23/00 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005949 | LOW THERMAL BUDGET LASER ANNEALING | US2025/031989 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/005980 | BRUSH BOX WAFER NOTCH DETECTION METHODS AND EXTENDED FUNCTIONALITY | US2025/032971 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006000 | PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENING | US2025/033209 | H01L 23/04 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006008 | PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTS | US2025/033405 | H01L 23/498 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006026 | DEVICE COMPRISING A PACKAGE, A LID FRAME, A THERMAL INTERFACE MATERIAL AND AN ADHESIVE | US2025/033635 | H01L 23/10 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006049 | FAST CARBON PLUGFILL FOR PATTERNS WITH LARGE CRITICAL DIMENSIONS | US2025/033909 | H01L 21/02 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006062 | HEATER MATERIALS TO PREVENT ARCING | US2025/034066 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006065 | SYSTEMS AND TECHNIQUES FOR GAS DELIVERY FOR SEMICONDUCTOR PROCESSING | US2025/034089 | H01L 21/67 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006068 | SEAL TO MITIGATE PARTICLE CONTAMINATION IN PLASMA CHAMBERS | US2025/034137 | H01L 21/687 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006111 | LEAD FRAME STRUCTURES FOR REFLOW MITIGATION IN LIGHT-EMITTING DIODE (LED) PACKAGES | US2025/034499 | H01L 25/075 | CREELED, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006164 | HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOLS WITH FACTORY INTERFACE CENTERING | US2025/034757 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006186 | AREA-ENHANCED COOLING MODULE AND ELECTRONIC ASSEMBLY WITH MICROJET CAPTURE MANIFOLD | US2025/034806 | H01L 23/473 | JETCOOL TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006191 | METHOD FOR EARLY THERMAL PERFORMANCE ASSESSMENT OF A HEATER COMPONENT | US2025/034817 | H01L 21/67 | WATLOW ELECTRIC MANUFACTURING COMPANY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006192 | THERMALLY STRUCTURED CERAMIC PEDESTAL | US2025/034818 | H01L 21/687 | WATLOW ELECTRIC MANUFACTURING COMPANY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006229 | HALL SENSOR WITH MULTILEVEL PACKAGE SUBSTRATE | US2025/034921 | H01L 25/065 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006271 | METHODS FOR CONTROLLING FLATNESS OF HANDLE STRUCTURES FOR USE IN SEMICONDUCTOR-ON-INSULATOR STRUCTURES | US2025/034989 | H01L 21/02 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006290 | THROUGH SUBSTRATE VIA FORMATION ON PATTERNED SUBSTRATES | US2025/035019 | H01L 21/48 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006295 | PASSIVATION DURING SILICON ETCH | US2025/035027 | H01L 21/3213 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006421 | LOW TEMPERATURE DOPED POLYSI BACKSIDE DEPOSITION FILM FOR ENHANCED CHUCKING/DECHUCKING IN SEMICONDUCTOR PROCESSING | US2025/035211 | H01L 21/302 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006469 | COMMUNICATION CHANNELS FOR A STACKED DIE CONFIGURATION | US2025/035280 | H01L 25/07 | ADVANCED MICRO DEVICES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006514 | PILLAR SELECTOR FOR WAFER-ON-WAFER MEMORY | US2025/035343 | H01L 23/522 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006772 | RELAXED INGAN LAYERS, DEVICES, AND METHODS OF FABRICATION | US2025/035752 | H01L 21/20 | OPNOVIX CORP. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006812 | DIRECT VOLTAGE CONTROL OF A CLAMPING SURFACE OF AN ELECTROSTATIC CLAMP | US2025/035811 | H01L 21/683 | AXCELIS TECHNOLOGIES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 01 | WO/2026/006827 | REAL-TIME COMPUTER VISION END-POINT DETECTION PIPELINE | US2025/035906 | H01L 21/66 | INFICON INC. | ELECTRICITY | الکتریسیته | دانش هسته ای |