هفته نامه اطلاع رسانی اختراعات منتشر شده در سازمان جهانی مالکیت فکری
invbazaar.com

سالهفتهIDTitleApplNoIPCApplicantSubgroupزیر گروهرشته شرحDescription
202601WO/2024/244426DISPLAY PANEL AND DISPLAY DEVICECN2023/140827H01L 27/15BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2025/059968FLAT PANEL DETECTOR AND DETECTION DEVICECN2023/120297H01L 27/146BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2025/129771WIRING SUBSTRATE AND PREPARATION METHOD THEREFOR, LIGHT-EMITTING SUBSTRATE, AND DISPLAY APPARATUSCN2024/071693H01L 23/498BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2025/179548ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICECN2024/079397H01L 27/12BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2025/194507DISPLAY SUBSTRATE AND DISPLAY APPARATUSCN2024/083390H01L 27/15BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2025/250904TREATMENTS FOR IMPROVING FRACTURE STRENGTH FOR SEMICONDUCTOR WORKPIECEUS2025/031597H01L 21/02WOLFSPEED, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000178DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUSCN2024/101338H01L 25/16BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000190LIGHT-EMITTING UNIT AND MANUFACTURING METHOD THEREFOR, AND LIGHT-EMITTING DIODE CHIPCN2024/101399H01L 25/075BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000291TERMINATION STRUCTURE OF A SUPER-JUNCTION METAL-OXIDE SEMICONDUCTORCN2024/101931H01L 29/06NEXPERIA B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000718LED DISPLAY DEVICE AND MANUFACTURING METHOD FOR LED DISPLAY DEVICECN2024/125478H01L 25/075FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000727SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCN2024/126303H01L 23/64CXMT CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000756GOLD-SILVER ALLOY STRUCTURE FOR SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFORCN2024/129800H01L 23/488SHENZHEN UNITED BLUE OCEAN APPLIED MATERIALS TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/000904SYSTEM-IN-PACKAGE MODULE AND PREPARATION METHOD, AND SMART RINGCN2024/142255H01L 23/31QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO.,LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001000QFN PACKAGED CHIPCN2025/076764H01L 23/495HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001004CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICECN2025/076827H01L 25/18HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001040CHIP PACKAGING ASSEMBLY, PREPARATION METHOD AND ELECTRONIC DEVICECN2025/079274H01L 25/07HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001061SEMICONDUCTOR MODULECN2025/080096H01L 25/07HISENSE HOME APPLIANCES GROUP CO.,LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001107FEEDING DEVICE AND FEEDING METHOD FOR CONVEYING LEAD FRAMESCN2025/083141H01L 21/677SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001108CONVEYING DEVICE FOR LEAD FRAMECN2025/083149H01L 21/677SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001111BGA CHIP PACKAGING STRUCTURE AND TESTING METHODCN2025/083224H01L 23/49SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001148SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR INTEGRATED STRUCTURECN2025/085550H01L 23/498CXMT CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001150HEAT DISSIPATION PACKAGE STRUCTURE AND ELECTRONIC DEVICECN2025/085832H01L 23/31HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001263HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION DEVICECN2025/091263H01L 23/473ZTE CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001294CHIP PACKAGE STRUCTURE AND RADIO FREQUENCY FRONT-END MODULECN2025/092160H01L 23/31RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001338ARRAY SUBSTRATE, MANUFACTURING METHOD AND DISPLAY DEVICECN2025/093841H01L 21/77BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001349HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUSCN2025/093941H01L 21/67ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001351SUBSTRATE AND MANUFACTURING METHOD THEREFOR, INTEGRATED PASSIVE DEVICE, AND ELECTRONIC APPARATUSCN2025/094136H01L 23/498BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001365SUBSTRATE EDGE ETCHING APPARATUSCN2025/094300H01L 21/67ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001518SUBSTRATE POSITIONING DEVICE AND SUBSTRATE POSITIONING METHODCN2025/097638H01L 21/68ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001574SUSPENDED HOLLOW SHAFT MAGNETIC LEVITATION WAFER MANUFACTURING APPARATUSCN2025/098614H01L 21/687SUZHOU SUPERMAG INTELLIGENT TECHNOLOGY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001752THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOFCN2025/101369H01L 25/065YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001808ALUMINUM FILM FOR PAD LAYER OF WAFER, AND COATING PROCESS THEREFORCN2025/101955H01L 23/488HANGZHOU MDK OPTO ELECTRONICS CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001853DIE ATTACHING MACHINECN2025/102458H01L 21/683CHIPMORE TECHNOLOGY CORPORATION LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001857HALF-BRIDGE POWER MODULE, INVERTER, AND VEHICLECN2025/102492H01L 23/367SHANGHAI LIXIANG AUTOMOBILE CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/001952METHOD FOR METALLIZATION OF ULTRA-HIGH ASPECT RATIO THROUGH SILICON VIA IN THREE-DIMENSIONAL INTEGRATED CIRCUITCN2025/103015H01L 21/768XIAMEN UNIVERSITYELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/002147MICRO LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREFORCN2025/103999H01L 25/16QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/002464SUBSTRATE STORAGE SYSTEM, SUBSTRATE HANDLING APPARATUS, METHOD OF TEMPORARILY STORING A SUBSTRATEEP2025/063333H01L 21/67ASML NETHERLANDS B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/002645CLAMPING SYSTEMS AND METHODS FOR SEMICONDUCTOR PROCESSINGEP2025/066419H01L 21/683ASML NETHERLANDS B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/002717ADJUSTING DEVICE, USE OF SUCH AN ADJUSTING DEVICE FOR POSITIONING OBJECTS, AND METHOD FOR POSITIONING OBJECTS USING SUCH AN ADJUSTING DEVICEEP2025/066884H01L 21/687PHYSIK INSTRUMENTE (PI) SE & CO. KGELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003423ELECTROMAGNETIC ABSORBING ARRANGEMENTFI2025/050352H01L 23/552TEKNOLOGIAN TUTKIMUSKESKUS VTT OYELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003547SEMICONDUCTOR CAPACITOR AND METHOD FOR MANUFACTURING SAMEIB2024/000292H01L 21/822NISSAN MOTOR CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003633FLUID JET COOLING DEVICE FOR ELECTRONIC EQUIPMENTIB2025/055881H01L 23/473WIELAND PROVIDES SRLELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003642HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURESIB2025/055972H01L 23/31INTERNATIONAL BUSINESS MACHINES CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003900METHOD FOR OPERATING SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION APPARATUSJP2024/022776H01L 21/3065HITACHI HIGH-TECH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003905PLASMA TREATMENT METHODJP2024/022802H01L 21/3065HITACHI HIGH-TECH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003906SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEJP2024/022805H01L 21/306NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003907METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2024/022806H01L 21/66NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003909SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2024/022813H01L 29/78MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003911METHOD FOR FABRICATING SEMICONDUCTOR DEVICEJP2024/022834H01L 21/205MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003919STRAIN INTRODUCTION METHODJP2024/022862H01L 21/324NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003932FILM DEPOSITION APPARATUS AND LASER MACHINING APPARATUSJP2024/022895H01L 21/301YAMAHA HATSUDOKI KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003968FILM FORMING APPARATUS AND LASER PROCESSING APPARATUSJP2024/023042H01L 21/301YAMAHA HATSUDOKI KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003996SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEJP2024/023187H01L 21/52MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/003997METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2024/023188H01L 21/52MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004012POWER ELEMENT MODULEJP2024/023239H01L 23/40MITSUBISHI HEAVY INDUSTRIES ENGINE & TURBOCHARGER, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004030PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICEJP2024/023297H01L 21/02JSW AKTINA SYSTEM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004034PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICEJP2024/023303H01L 21/02JSW AKTINA SYSTEM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004036PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICEJP2024/023313H01L 21/3065HITACHI HIGH-TECH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004037PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICEJP2024/023316H01L 21/268JSW AKTINA SYSTEM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004038PROGRAM, INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND LASER PROCESSING DEVICEJP2024/023317H01L 21/268JSW AKTINA SYSTEM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004052SUBSTRATE STORAGE CONTAINER, FILTER UNIT, AND AGGREGATED FILTERJP2024/023364H01L 21/673MIRAIAL CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004107SEMICONDUCTOR THIN FILM STRUCTUREJP2024/023556H01L 21/20NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004114COOLER AND SEMICONDUCTOR DEVICEJP2024/023577H01L 23/473ASTEMO, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004127LIGHT DETECTION DEVICE AND RANGING DEVICEJP2024/023610H01L 31/107SONY SEMICONDUCTOR SOLUTIONS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004139SUBSTRATE PROCESSING DEVICE, TEACHING METHOD FOR TRANSFER MACHINE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE TRANSFER SYSTEM, AND PROGRAMJP2024/023664H01L 21/67KOKUSAI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004197CLEANING METHODJP2025/003371H01L 21/677TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004286SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEJP2025/013360H01L 21/768DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004294SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICEJP2025/013851H01L 21/304SCREEN HOLDINGS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004347OPTICAL PACKAGE, MODULE, AND METHOD FOR MANUFACTURING OPTICAL PACKAGEJP2025/016632H01L 23/02SONY SEMICONDUCTOR SOLUTIONS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004352SEMICONDUCTOR DEVICEJP2025/016839H01L 25/07FUJI ELECTRIC CO.,LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004360METHOD AND SYSTEM FOR REUSING REACTIVE GASJP2025/017155H01L 21/205ORGANO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004372ELECTRONIC COMPONENTJP2025/017457H01L 25/00MURATA MANUFACTURING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004395CUTTING DEVICE AND METHOD FOR PRODUCING CUT ARTICLEJP2025/018041H01L 21/301TOWA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004465VAPOR CHAMBER COMPOSITE MANUFACTURING METHOD AND LAMINATE MANUFACTURING METHODJP2025/019432H01L 23/427NHK SPRING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004548GRINDING METHOD FOR SEMICONDUCTOR CRYSTAL AND GRINDING WHEEL FOR GRINDING USED IN SAID GRINDING METHODJP2025/020671H01L 21/304SUCCESS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004573SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING DEVICEJP2025/020875H01L 21/02CENTRAL GLASS COMPANY, LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004574DRY ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ETCHING DEVICEJP2025/020876H01L 21/302CENTRAL GLASS COMPANY, LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004597PLASMA PROCESSING APPARATUSJP2025/021062H01L 21/3065TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004601TRANSPORTATION DEVICE AND CONNECTION METHODJP2025/021080H01L 21/677TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004649SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, PROGRAM, AND STORAGE MEDIUMJP2025/021467H01L 21/304TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004650SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, PROGRAM, AND STORAGE MEDIUMJP2025/021469H01L 21/304TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004670PROCESSING SYSTEM, PROCESSING METHOD, AND TRANSPORT DEVICEJP2025/021605H01L 21/50TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004709SEMICONDUCTOR DEVICEJP2025/021909H01L 23/31ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004725TREATMENT DEVICE AND TREATMENT METHODJP2025/021993H01L 21/027TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004729TREATMENT LIQUID FOR SEMICONDUCTOR SUBSTRATEJP2025/022046H01L 21/306TOKUYAMA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004734CONVEYANCE-CONTAINER LID FALL-OFF DETECTION DEVICE, LOAD PORT, AND CONVEYANCE-CONTAINER LID FALL-OFF DETECTION METHODJP2025/022068H01L 21/677SINFONIA TECHNOLOGY CO.,LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004740SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULEJP2025/022094H01L 23/48ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004849METHOD FOR MANUFACTURING ε-TYPE GALLIUM OXIDE FILM, AND ε-TYPE GALLIUM OXIDE FILMJP2025/022698H01L 21/203TAK THIN FILM DEVICE LABORATORY INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004886MOUNTING APPARATUSJP2025/022804H01L 21/60SHINKAWA LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/004976METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODYJP2025/023080H01L 21/52RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005028SUPPORT MEMBER, ELECTROSTATIC CHUCK, HEATER, AND PLASMA TREATMENT DEVICEJP2025/023273H01L 21/683KYOCERA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005147SUBSTRATE PROCESSING SYSTEMKR2024/017534H01L 21/67WONIK IPS CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005148SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING SYSTEM INSTALLATION METHODKR2024/017537H01L 21/67WONIK IPS CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005149BUFFER MODULE AND SUBSTRATE PROCESSING SYSTEM INCLUDING SAMEKR2024/017539H01L 21/677WONIK IPS CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005175POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICEKR2025/002666H01L 23/495LX SEMICON CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005176POWER SEMICONDUCTOR MODULEKR2025/002667H01L 23/495LX SEMICON CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005220HEATING DEVICE AND METHOD FOR HEATING TO-BE-PROCESSED SEMICONDUCTOR SUBSTRATE IN LASER ANNEALING PROCESS, LASER ANNEALING DEVICE AND METHOD USING SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND METHODKR2025/004709H01L 21/67RNR LAB INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005272DISPLAY APPARTUS HAVING DISPLAY MODULEKR2025/006337H01L 25/075SAMSUNG ELECTRONICS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005346CERAMIC SUSCEPTOR INCLUDING CORE/SHELL STRUCTURED MATERIAL AS COATING LAYERKR2025/008062H01L 21/687KSM COMPONENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005369DISPLAY DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING SAMEKR2025/008347H01L 25/075SAMSUNG DISPLAY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005384DISPLAY DEVICE AND ELECTRONIC DEVICEKR2025/008484H01L 25/075SAMSUNG DISPLAY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005440THIN FILM FORMING METHODKR2025/008800H01L 21/02JUSUNG ENGINEERING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005481POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR MODULEKR2025/008905H01L 25/07LX SEMICON CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005503ANISOTROPIC CONDUCTIVE MATERIAL COMPOSITIONKR2025/008986H01L 23/00ENJET CO. LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005504CONNECTION STRUCTUREKR2025/008989H01L 23/00ENJET CO. LTDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005601Method for light-induced release of one or more components from a donor substrate to an acceptor substrate, and a donor substrate and system thereforNL2025/050311H01L 21/67NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNOELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005782PLATFORM-INTEGRABLE INTERCONNECTS FOR CONTACTLESS COUPLING OF COMPUTER MODULESUS2024/035932H01L 23/66INTEL CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005821HIGH BANDWIDTH FLASH MEMORY CONTAINING A STACK OF BONDED LOGIC AND MEMORY DIE ASSEMBLIES AND METHODS FOR FORMING THE SAMEUS2025/011303H01L 23/00SANDISK TECHNOLOGIES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005837METHOD AND APPARATUS FOR DAMASCENE ETCHINGUS2025/019103H01L 21/311TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005841CONFIGURABLE DIE-TO-DIE LANE REPAIR IN MULTI-DIE SYSTEMS COUPLED USING LINK MACROSUS2025/019266H01L 21/66MICROSOFT TECHNOLOGY LICENSING, LLCELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005849BONDING METHOD WITH LOCATION SPECIFIC PROCESSINGUS2025/019479H01L 21/18TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005892BATTERY CELLS WITH STACKED ELECTRICAL CONDUCTORSUS2025/028299H01L 21/768KYMA BATTERIES LLCELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005894SUBSTRATE PROCESSING FOR IMPROVED WAFER THICKNESS UNIFORMITYUS2025/028546H01L 21/3065APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005908IN-LINE WAFER POSITIONING SYSTEM USING IR IMAGINGUS2025/029723H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005920ELECTROMAGNETIC INTERFERENCE SHIELD HAVING MESH GRID GROUND FENCE METALLIZATION PATTERNUS2025/030220H01L 23/552QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005921WAFER OVERLAY REGISTRATION IN HYBRID BONDINGUS2025/030264H01L 23/00TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005949LOW THERMAL BUDGET LASER ANNEALINGUS2025/031989H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/005980BRUSH BOX WAFER NOTCH DETECTION METHODS AND EXTENDED FUNCTIONALITYUS2025/032971H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006000PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENINGUS2025/033209H01L 23/04QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006008PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTSUS2025/033405H01L 23/498QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006026DEVICE COMPRISING A PACKAGE, A LID FRAME, A THERMAL INTERFACE MATERIAL AND AN ADHESIVEUS2025/033635H01L 23/10QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006049FAST CARBON PLUGFILL FOR PATTERNS WITH LARGE CRITICAL DIMENSIONSUS2025/033909H01L 21/02APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006062HEATER MATERIALS TO PREVENT ARCINGUS2025/034066H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006065SYSTEMS AND TECHNIQUES FOR GAS DELIVERY FOR SEMICONDUCTOR PROCESSINGUS2025/034089H01L 21/67LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006068SEAL TO MITIGATE PARTICLE CONTAMINATION IN PLASMA CHAMBERSUS2025/034137H01L 21/687LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006111LEAD FRAME STRUCTURES FOR REFLOW MITIGATION IN LIGHT-EMITTING DIODE (LED) PACKAGESUS2025/034499H01L 25/075CREELED, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006164HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOLS WITH FACTORY INTERFACE CENTERINGUS2025/034757H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006186AREA-ENHANCED COOLING MODULE AND ELECTRONIC ASSEMBLY WITH MICROJET CAPTURE MANIFOLDUS2025/034806H01L 23/473JETCOOL TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006191METHOD FOR EARLY THERMAL PERFORMANCE ASSESSMENT OF A HEATER COMPONENTUS2025/034817H01L 21/67WATLOW ELECTRIC MANUFACTURING COMPANYELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006192THERMALLY STRUCTURED CERAMIC PEDESTALUS2025/034818H01L 21/687WATLOW ELECTRIC MANUFACTURING COMPANYELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006229HALL SENSOR WITH MULTILEVEL PACKAGE SUBSTRATEUS2025/034921H01L 25/065TEXAS INSTRUMENTS INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006271METHODS FOR CONTROLLING FLATNESS OF HANDLE STRUCTURES FOR USE IN SEMICONDUCTOR-ON-INSULATOR STRUCTURESUS2025/034989H01L 21/02GLOBALWAFERS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006290THROUGH SUBSTRATE VIA FORMATION ON PATTERNED SUBSTRATESUS2025/035019H01L 21/48APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006295PASSIVATION DURING SILICON ETCHUS2025/035027H01L 21/3213LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006421LOW TEMPERATURE DOPED POLYSI BACKSIDE DEPOSITION FILM FOR ENHANCED CHUCKING/DECHUCKING IN SEMICONDUCTOR PROCESSINGUS2025/035211H01L 21/302LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006469COMMUNICATION CHANNELS FOR A STACKED DIE CONFIGURATIONUS2025/035280H01L 25/07ADVANCED MICRO DEVICES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006514PILLAR SELECTOR FOR WAFER-ON-WAFER MEMORYUS2025/035343H01L 23/522MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006772RELAXED INGAN LAYERS, DEVICES, AND METHODS OF FABRICATIONUS2025/035752H01L 21/20OPNOVIX CORP.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006812DIRECT VOLTAGE CONTROL OF A CLAMPING SURFACE OF AN ELECTROSTATIC CLAMPUS2025/035811H01L 21/683AXCELIS TECHNOLOGIES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202601WO/2026/006827REAL-TIME COMPUTER VISION END-POINT DETECTION PIPELINEUS2025/035906H01L 21/66INFICON INC.ELECTRICITYالکتریسیتهدانش هسته ای